To solve the manufacturing issues and to strengthen manufacturing competitiveness; case studies introduce how TANAKA’s products are solving customer’s issues.
One Stop Service providing a centralized location for information sharing, enabling earlier market launch and a rapid improvement to speed of development.
Chipmaker, D Inc.
Compact and lightweight – the next generation technology development proposition.Helping projects succeed through innovative material recycling ideas.
Chipmaker, Y Inc.
With just a small capital investment, material costs can be reduced by 80%.
Silver bonding wire exhibits excellent durability, conductivity and speed of production.
Chipmaker, E Inc.
Use of copper bonding wire reduces material costs by 90% to resolve the issue of steeply rising gold prices impacting profits.
Chipmaker, M Inc.
End-customer complained about a drop in precision of component analysis.
So what was the secret to achieving high precision, high durability and low costs?
Company W (Quality Assurance Dept. of ceramics manufacturer)
With delivery required in just two months, high quality, low cost thick film paste was an essential element in the success of new products.
Ceramic substrates maker; Z Inc.
Just when you thought there could be no further productivity improvements and cost reductions.
What sort of plating can reduce production line downtime to one third?
Company A (semiconductor manufacturer)
New product development project aimed to win out amidst fierce price competition.
The key to success was reducing the use of precious metals.
Company B (consumer electronics manufacturer)
There are already limits to achieving cost reductions on production lines while still maintaining the same quality.
As a last measure, success was found in the handling process for industrial waste.
Electronic device maker;D Inc.
Customers were demanding cost reductions. The secret to turning this crisis into opportunity lay with a bold move to change the connector plating process.
Electronic Information Device Parts Manufacturer; Y Inc.